| 摘要 |
This solid-state image pickup device is provided with: a first chip, which has a pixel array wherein a plurality of photoelectric conversion sections that convert inputted light into electric signals are disposed; a second chip, which has a smaller area in a planar view compared with an area of the first chip in a planar view, and which is electrically and physically connected to the first chip; and a supporting section, which is provided to cover the whole first chip surface region not covered with the second chip, said region being a part of a first chip surface having the second chip connected thereto, and which supports the first chip such that planarity of the first chip is maintained. |
