| 摘要 |
PURPOSE: A semiconductor device, a manufacturing method thereof, and an electronic device are provided to prevent the lowering of the performance of the semiconductor chip by minimizing a chipping phenomenon and a crack phenomenon. CONSTITUTION: A wafer(100) is provided. The wafer includes a chip area(110) with a semiconductor chip and a scribe area surrounding each chip area between chip areas. The wafer has the first surface. The penetration extending holes(130) and scribe connection parts(140) are formed along a scribe lane area. The scribe connection parts connect the chip areas between the penetration extension holes. The penetration extending holes pass through the wafer. The chip areas are separated by cutting the scribe connection parts.
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