发明名称 |
SEMICONDUCTOR TESTING JIG |
摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor testing jig capable of improving workability at a time of testing a plurality of vertical semiconductor devices, shortening testing time, and easily dealing with various sizes of semiconductor devices.SOLUTION: A semiconductor testing jig is used to test a plurality of vertical semiconductor devices 5 each including a lower surface electrode 3 and an upper surface electrode 4. A conductive base 1 includes a plurality of installation portions 6 in which the vertical semiconductor devices 5 are individually installed in a state in which the lower surface electrodes 3 contact the installation portions 6. A lattice insulating frame 2 is provided on the base 1 for surrounding the installation portions 6. The frame 2 is replaceable depending on sizes of the vertical semiconductor devices 5 to be installed. |
申请公布号 |
JP2015034704(A) |
申请公布日期 |
2015.02.19 |
申请号 |
JP20130164344 |
申请日期 |
2013.08.07 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
OKADA AKIRA;YAMASHITA KINYA;AKIYAMA HAJIME;NOGUCHI TAKAYA |
分类号 |
G01R31/26;H01L21/336;H01L21/66;H01L29/78 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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