| 发明名称 |
RESIN COMPOSITION, PRINTED CIRCUIT BOARD USING THE COMPOSITION, AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound. |
| 申请公布号 |
US2015050473(A1) |
申请公布日期 |
2015.02.19 |
| 申请号 |
US201414445771 |
申请日期 |
2014.07.29 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SEO Young Kwan;KIM Jun Young |
| 分类号 |
G03F7/085;H05K1/03;H05K1/11;H05K3/00 |
主分类号 |
G03F7/085 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin composition comprising:
a photopolymerizable compound having a polymerizable ethylenically unsaturated bond in a molecule; a photoinitiator; and a silica surface-functionalized with an alkyl sulfonated tetrazole compound represented by: where R1 is selected from a C1-C20 aliphatic or alicyclic alkyl group, and a C6-C20 aryl group or aralkyl group, and n is an integer of 1 to 6. |
| 地址 |
Suwon KR |
