发明名称 ウエハ処理装置、ウエハ処理方法及び半導体装置の製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wafer processing apparatus which can prevent product failure even when failing in exchange of a processed wafer on a wafer holder. <P>SOLUTION: A wafer processing apparatus 1 comprises: a wafer holder 31 having pedestals P1-P13; a wafer transfer mechanism 30 rotating the wafer holder 31 after wafers loaded on the pedestals P1-P13 are processed so as to sequentially position the pedestals P1-P13 at prescribed attachment positions to remove the wafers from the positioned pedestals and subsequently loading unprocessed wafers on the pedestals; a wafer transfer control part 62; and a detection sensor 38. The wafer holder 31 includes a detection target part 31s. The detection sensor 38 outputs a determination signal indicating whether a position of the detection target part 31s coincides with a reference position when any one of the pedestals P1-P13 is positioned at the attachment position. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5670682(B2) 申请公布日期 2015.02.18
申请号 JP20100208200 申请日期 2010.09.16
申请人 发明人
分类号 H01L21/677;H01L21/265;H01L21/68 主分类号 H01L21/677
代理机构 代理人
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