| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a plating device which can efficiently perform plating treatment in a short plating time, and can improve the quality of the object to be plated, a plating method, and a method for producing a chip type electronic component. <P>SOLUTION: The plating device includes: a first cathode electrode 23b composing at least a part of the inner circumferential wall face 23a of a recessed vessel 20a storing a plating liquid; a second cathode electrode 22b insulated from the first cathode electrode 23b and composing at least a part of the bottom face 22a of the recessed vessel 20a; an anode electrode 40 dipped into the plating liquid 30 stored into the recessed vessel 20a; and a rotating tool 21a rotating the recessed vessel 20a around a central axis 20T almost vertical to the bottom face 22a. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
