| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor element inspecting substrate, in which breakage such as a crack is hardly caused in the periphery of a metallized layer with a stud joined thereto. <P>SOLUTION: The peripheral end of a fillet 61 is held to the inside from the peripheral end of a metallized layer 57 so as to satisfy predetermined conditions indicated in the claim 1. That is, a ratio (F/H) of the length F of the base of a fillet 61 to the height H of the fillet 61 is 4.3 or above. Accordingly, the joint strength of a stud 23 is increased, producing an effect that breakage such as a crack is hardly caused in the periphery of the metallized layer 57 with the stud 23 joined thereto. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
