发明名称 Formation of multi-height MUGFET
摘要 A method and structure comprise a field effect transistor structure that includes a first rectangular fin structure and a second rectangular fin structure, both positioned on a substrate. The sides of the second rectangular fin structure are parallel to the sides of the first rectangular fin structure. Further, a trench insulator is positioned on the substrate and positioned between a side of the first rectangular fin structure and a side of the second rectangular fin structure. A gate conductor is positioned on the trench insulator, positioned over the sides and the top of the first rectangular fin structure, and positioned over the sides and the top of the second rectangular fin structure. The gate conductor runs perpendicular to the sides of the first rectangular fin structure and the sides of the second rectangular fin structure. Also, a gate insulator is positioned between the gate conductor and the first rectangular fin structure and between the gate conductor and the second rectangular fin structure. The gate conductor is positioned adjacent to a relatively larger portion of the sides of the second rectangular fin structure and is positioned adjacent to a relatively smaller portion of the sides of the first rectangular fin structure.
申请公布号 US8957479(B2) 申请公布日期 2015.02.17
申请号 US201313933356 申请日期 2013.07.02
申请人 International Business Machines Corporation 发明人 Anderson Brent A.;Nowak Edward J.;Rankin Jed H.
分类号 H01L29/78;H01L27/088;H01L21/8234;H01L29/66;H01L27/12 主分类号 H01L29/78
代理机构 Gibb & Riley, LLC 代理人 Gibb & Riley, LLC
主权项 1. A field effect transistor structure comprising: a substrate; a first rectangular fin structure positioned on said substrate, said first rectangular fin structure having a bottom contacting said substrate, a top opposite said bottom, and sides between said top and said bottom; a second rectangular fin structure positioned on said substrate, said second rectangular fin structure having a bottom contacting said substrate, a top opposite said bottom, and sides between said top and said bottom, said sides of said second rectangular fin structure being parallel to said sides of said first rectangular fin structure; a trench insulator positioned on said substrate and positioned between a side of said first rectangular fin structure and a side of said second rectangular fin structure; a gate conductor positioned on said trench insulator, positioned over said sides and said top of said first rectangular fin structure and positioned over said sides and said top of said second rectangular fin structure, said gate conductor running perpendicular to said sides of said first rectangular fin structure and said sides of said second rectangular fin structure; and a gate insulator positioned between said gate conductor and said first rectangular fin structure and between said gate conductor and said second rectangular fin structure, said sides of said first rectangular fin structure comprising a lower portion and an upper portion, said upper portion of said sides of said first rectangular fin structure being relatively closer to said top of said first rectangular fin structure and said lower portion of said sides of said first rectangular fin structure being relatively farther from said top of said first rectangular fin structure, said gate conductor being positioned adjacent to said upper portion of said sides of said first rectangular fin structure, said lower portion of said sides of said first rectangular fin structure being positioned adjacent to said trench insulator, said gate conductor being positioned adjacent to a relatively larger portion of said sides of said second rectangular fin structure and being positioned adjacent to a relatively smaller portion of said sides of said first rectangular fin structure, said first rectangular fin structure comprising a central semiconductor portion comprising a channel region, and comprising conductive end portions comprising source and drain regions, and said second rectangular fin structure comprising a central semiconductor portion comprising a channel region, and comprising conductive end portions comprising source and drain regions.
地址 Armonk NY US