| 摘要 |
<p>The present invention relates to an alignment member for semiconductor device test device comprising a plurality of alignment holes (11) and a plurality of alignment pins (21) respectively formed on each of a first module (10) and a second module (20), or each of the second module (20) and the first module (10) in order to align the first module (10) on which a semiconductor device is mounted and the second module (20) including a plurality of probe pins corresponding to terminals of the semiconductor device. The alignment pins (21) respectively include same diameter sections (C) of which a diameter is constant and a reduction diameter sections (R) of which the diameter is gradually decreased. In the alignment pins (21), heights of the same diameter sections (C) are different from each other, so that heights of the alignment pins (21) are different from each other. According to the present invention, since the accuracy of the alignment is maintained to the same level, and also, an area of a friction surface is reduced, a trapped phenomenon or a trapped level can be considerably reduced. The trapped level is maintained to the same level, and also, the accuracy of the alignment can be considerably improved.</p> |
