| 发明名称 | Method for fabricating a bond | ||
| 摘要 | The invention relates to a method for fabricating a bond by providing a body including a metallic surface provided with an inorganic, dielectric protective layer. The protective layer covers at least one surface zone of the metallic surface in which the metallic surface is to be electrically conductive bonded to a contact conductor. To fabricate the bond, a portion of a provided contact conductor above the surface zone is pressed on to the protective layer and the body so that the protective layer is destroyed above the surface zone in achieving an electrically conductive bond between the metallic surface and the contact conductor. | ||
| 申请公布号 | US8955219(B2) | 申请公布日期 | 2015.02.17 |
| 申请号 | US201012709552 | 申请日期 | 2010.02.22 |
| 申请人 | Infineon Technologies AG | 发明人 | Roth Roman;Siepe Dirk |
| 分类号 | H01R43/00;H05K13/00 | 主分类号 | H01R43/00 |
| 代理机构 | Murphy, Bilak & Homiller, PLLC | 代理人 | Murphy, Bilak & Homiller, PLLC |
| 主权项 | 1. A method for fabricating a bond comprising the steps: providing a body comprising a metallic surface provided with an inorganic, dielectric protective layer covering at least one surface zone of the metallic surface in which the metallic surface is to be electrically conductive bonded to a contact conductor; providing a contact conductor; destroying the protective layer above the surface zone by pulverizing in addition to generating a press force F pressing a portion of the contact conductor to the protective layer and body above the surface zone; fabricating an electrically conductive bond between the metallic surface and the contact conductor. | ||
| 地址 | Neubiberg DE | ||