Method for manufacturing nano-imprint mould, method for manufacturing light-emitting diode using the nano imprint mould manufactured thereby, and light-emitting diode manufactured thereby

摘要

A method of manufacturing a light emitting diode, includes a process of forming an n-type nitride semiconductor layer, a light emitting layer, and a p-type nitride semiconductor layer on a temporary substrate, a process of forming a p-type electrode on the p-type nitride semiconductor layer, a process of forming a conductive substrate on the p-type electrode, a process of removing the temporary substrate to expose the n-type nitride semiconductor layer, a process of forming a nanoimprint resist layer on the n-type nitride semiconductor layer, a process of pressing the nanoimprint mold on the nanoimprint resist layer to transfer the nano-pattern onto the nanoimprint resist layer, and a process of separating the nanoimprint mold from the nanoimprint resist layer having the nano-pattern and etching a portion of the nanoimprint resist layer having the nano-pattern to form an n-type electrode.

主权项

1. A method of manufacturing a light emitting diode, the method comprising:
(a) manufacturing a nanoimprint mold, comprising:
(a1) coating nano structures on the semiconductor substrate;(a2) forming a nano-pattern having a hemispherical shape on the semiconductor substrate through a dry etching process using the nano structures as masks;(a3) transferring the hemispherical-shaped nano-pattern formed on the semiconductor substrate onto a nanoimprint mold in a nanoimprinting manner; and(a4) separating the nanoimprint mold on which the hemispherical shape is transferred from the semiconductor substrate; (b) forming an n-type nitride semiconductor layer, a light emitting layer, and a p-type nitride semiconductor layer on a temporary substrate; (c) forming a p-type electrode on the p-type nitride semiconductor layer; (d) forming a conductive substrate on the p-type electrode; (e) removing the temporary substrate to expose the n-type nitride semiconductor layer; (f) forming a nanoimprint resist layer on the n-type nitride semiconductor layer; (g) pressing the nanoimprint mold manufactured by the step of (a) on the nanoimprint resist layer to transfer the hemispherical-shaped nano-pattern formed on the nanoimprint mold onto the nanoimprint resist layer; (h) separating the nanoimprint mold from the nanoimprint resist layer having the nano-pattern having the hemispherical shape; (i) etching a portion of the nanoimprint resist layer having the nano-pattern having the hemispherical shape to form an n-type electrode; and (j) forming a refractive index adjustment layer between the n-type nitride semiconductor layer and the nanoimprint resist layer, wherein the refractive index adjustment layer has a refractive index less than that of the n-type nitride semiconductor layer and greater than that of the nanoimprint resist layer, wherein the refractive index adjustment layer is formed by sequentially stacking a first refractive index adjustment layer and a second refractive index adjustment layer which refract light emitted from the light emitting layer by refractive indexes different from each other, wherein the first refractive index adjustment layer is formed on the n-type nitride semiconductor layer and has a refractive index less than that of the n-type nitride semiconductor layer, and the second refractive index adjustment layer is formed on the first refractive index adjustment layer and has a refractive index less than that of the first refractive index adjustment layer and greater than that of the nanoimprint resist layer.