| 摘要 |
<P>PROBLEM TO BE SOLVED: To avoid interference of the electrode of a semiconductor device and the tip of the movable contact of a contact terminal reliably when the semiconductor device is attached. <P>SOLUTION: When a cover member 12 is made to descend for a socket body 10 and approaches the socket body 10, a positioning member 14 to which a semiconductor device DV is attached is pushed up temporarily by the abutting part 26t of lever members 26, 26' for the contact part of the movable side contact piece 20m and the fixed side contact piece 20f of a contact terminal 20ai so as to be separated. <P>COPYRIGHT: (C)2012,JPO&INPIT |
