| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a component mounting substrate which is capable of dealing with further thinning of the component mounting substrate and makes the substrate unlikely to be warped even after a high temperature of component mounting in a reflow step, and a thermally curable resin composition suitable for insulation layer formation of a thin-shape component mounting substrate.SOLUTION: The manufacturing method of the component mounting substrate includes a thermal curing step of forming a cured product layer by heating and curing a thermally curable resin composition layer formed on an inner layer substrate; and a reflow step of mounting a component on a substrate including the cured product layer by reflowing. A shrinkage factor (S1) in an x-y direction after the thermal curing step of the thermally curable resin composition layer is 0.35% or less, a shrinkage factor (S2) in the x-y direction after the reflow step of the cured product layer is 0.4% or less, and S1 and S2 satisfy a relation of S2-S1≤0.08. The thermally curable resin composition for forming an insulation layer is also disclosed. The thermally curable resin composition is thermally cured under a condition that the shrinkage factor (S1) in the x-y direction after thermal curing becomes 0.35% or less. After a cured product of the thermally curable resin composition is heated in accordance with a reflow temperature profile compliant to IPC/JEDEC J-STD-020C, the shrinkage factor (S2) in the x-y direction is 0.4% or less and S1 and S2 satisfy a relation of S2-S1≤0.08. |
