| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a short circuit between components in mounting the components on a resin multilayer substrate, thereby easily dealing with an increased number and smaller gap of the components.SOLUTION: A resin multilayer substrate 101 includes a laminate 1 comprising a plurality of resin sheets 2 laminated therein. An upper surface of a first resin sheet 2u disposed at the outermost layer among the plurality of resin sheets 2 includes: a first region 61 and a second region 62 which have a first height while being a same resin sheet; and a third region 63 disposed to isolate the first region 61 from the second region 62 and having a second height higher than the first height. A first component 3a is mounted on the first region 61, and a second component 3b is mounted on the second region 62.</p> |
