| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which easily improves connection strength of a connection pad.SOLUTION: In a part (a connection pad 5) where a conductor layer 2 provided on a main surface of an insulating substrate 1 overlaps each of a plurality of openings 4 of an isolating layer 3, a wiring board is larger than the part overlapping the isolating layer 3 around it. Since thickness of the connection pad 5 is comparatively large, the connection strength of the connection pad 5 can be improved. Also, in a part other than the connection pad 5, thickness of the conductor layer 2 is relatively small, so that thermal stress occurring between the conductor layer 2 and the insulating substrate 1 is reduced, and deformation such as warpage of the wiring board 10 is suppressed. |
