发明名称 ULTRAVIOLET IRRADIATION DEVICE, AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To uniformly irradiate ultraviolet in a substrate.SOLUTION: An ultraviolet irradiation device 40 includes a wafer holding mechanism 101, and a light source 102 for irradiating ultraviolet, and has an ultraviolet irradiation chamber 103 in which transfer ports 110, 111 for the wafer holding mechanism 101 to pass are formed, an exhaust mechanism 120 for exhausting to decompress the ultraviolet irradiation chamber 103, a before-irradiation standby part 106 for making the wafer holding mechanism 101 stand by, an after-irradiation retreat part 107 provided on an opposite side to the standby part 106 with the ultraviolet irradiation chamber 103 interposed therebetween, and a holding part transfer mechanism 105 for moving the wafer holding mechanism 101. The light source 102 is a long lamp disposed so as to extend in a direction perpendicular to the moving direction of the wafer holding mechanism 101, and a width of the ultraviolet irradiation chamber 103 in a direction perpendicular to the extending direction of the lamp is smaller than a diameter of a wafer W.
申请公布号 JP2015032757(A) 申请公布日期 2015.02.16
申请号 JP20130162759 申请日期 2013.08.05
申请人 TOKYO ELECTRON LTD 发明人 KOBAYASHI SHINJI
分类号 H01L21/302;B01J19/12;H01L21/304 主分类号 H01L21/302
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