| 摘要 |
<p>The present invention relates to a device to automatically push a substrate in a semiconductor manufacturing process and, more specifically, to an automatic substrate push device, capable of improving the convenience of maintaining the device by reducing a width length of the device by vertically applying a motor, not horizontally, and lifting up a push bar for pushing a material. To describe the present invention more concretely, the present invention provides an automatic substrate push device, for delivering a substrate to a wire bonding device in a semiconductor manufacturing process, including: a plate, an operating part formed on an upper part of the plate to make the substrate movable, a position adjusting part combined with a lower part of a side of the plate to make the substrate push device move left and right to push the substrate in a desired position, a shaft vertically combined with the plate, a height adjusting part combined to surround the shaft and moving up and down, a body part combined with a side of the height adjusting part to adjust a push distance of the substrate, a motor part installed in a lower part of a side of the body part, a push bar installed in an upper part of the body part and pushing the substrate to the wire bonding device, and a push means for linearly pushing the push bar.</p> |
