发明名称 硬化性樹脂組成物及びその硬化物、封止剤、並びに光半導体装置
摘要 Provided is a curable resin composition capable of forming a cured product that excels in heat resistance, transparency, and flexibility and particularly excels in barrier properties against a corrosive gas (e.g., sulfur oxide). The curable resin composition includes a compound (U) containing an aliphatic carbon-carbon unsaturated bond and a compound (H) containing a hydrosilyl group and includes at least one of a ladder-type silsesquioxane [A1] and a ladder-type silsesquioxane [A2], where the ladder-type silsesquioxane [A1] contains an aliphatic carbon-carbon unsaturated bond and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard, and the ladder-type silsesquioxane [A2] contains a hydrosilyl group and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard.
申请公布号 JP5667326(B2) 申请公布日期 2015.02.12
申请号 JP20140516858 申请日期 2013.05.17
申请人 株式会社ダイセル 发明人 禿 恵明;桑名 章博;原田 伸彦
分类号 C08L83/07;C08K5/3477;C08K5/541;C08L63/00;C08L83/05;C09K3/10 主分类号 C08L83/07
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