| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a die bonder device and a die bond process using the die bonder, capable of reducing void in a bonding part and bonding failure of a boundary surface. <P>SOLUTION: The die bonder equipment that bonds a semiconductor chip to a lead frame or a substrate by solder, includes: a transportation part that transports the lead frame or substrate; a solder supply part that supplies solder onto the lead frame or the substrate; a mounting part that mounts and bonds the semiconductor chip onto the solder on the lead frame or the substrate; and a surface cleaning unit that removes an oxide film of the solder surface just before the solder is supplied to the lead frame or the substrate, thereby improving the die bond quality. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
