| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an aqueous polyamide resin dispersion which does not contains an emulsifier and a surfactant substantially, from which a polyamide resin coating film having excellent adhesiveness, flexibility, chemical resistance and heat-resistant adhesion properties can be obtained, which is excellent in dispersion stability even at room temperature and the polyamide resin of which has the small particle size enough to form a dense coating film. <P>SOLUTION: The aqueous polyamide resin dispersion is obtained by dispersing a dimer acid-based polyamide resin, which contains a dimer acid of≥50 mol% of the whole dicarboxylic acid component as a dicarboxylic acid component and has 1-20 mg-KOH/g acid value, in an aqueous medium. The aqueous polyamide resin dispersion contains a basic compound having <185°C boiling point under normal pressure but does not contain an auxiliary dispersant, which has≥185°C under normal pressure or is nonvolatile, substantially. The number-average particle diameter of the dimer acid-based polyamide resin in the aqueous medium is≤0.5μm. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
