| 发明名称 |
BONDING STRUCTURE INCLUDING METAL NANO PARTICLES AND BONDING METHOD USING METAL NANO PARTICLES |
| 摘要 |
A bonding structure including metal nano particles includes a first member having a metal surface on at least one side, a second member having a metal surface on at least one side, the second member being disposed such that the metal surface of the second member faces the metal surface of the first member, and a bonding material bonding the first member and the second member by sinter-bonding the metal nano particles. At least one of the metal surfaces of the first member and the second member is formed to be a rough surface having a surface roughness within the range from 0.5 μm to 2.0 μm. |
| 申请公布号 |
US2015041827(A1) |
申请公布日期 |
2015.02.12 |
| 申请号 |
US201414247272 |
申请日期 |
2014.04.08 |
| 申请人 |
Mitsubishi Electric Corporation |
发明人 |
IWATA Aya;HINO Yasunari |
| 分类号 |
H01L23/00;H01L29/16;H01L23/482 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bonding structure including metal nano particles, comprising:
a first member having a metal surface on at least one side; a second member having a metal surface on at least one side, said second member being disposed such that said metal surface of said second member faces said metal surface of said first member; and a bonding material bonding said first member and said second member by sinter-bonding the metal nano particles, wherein at least one of said metal surfaces of said first member and said second member is formed to be a rough surface having a surface roughness of 0.5 μm to 2.0 μm. |
| 地址 |
Tokyo JP |
