发明名称 WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a wiring board excellent in electrical reliability, and to provide a mounting structure using the wiring board.SOLUTION: A wiring board 3 in one embodiment comprises: a first insulation layer 22; a plurality of pads 23 which are arranged on one principal surface of the first insulation layer 22 and electrically connected with an electronic component 2; and a plurality of via conductors 9 which pierce the first insulation layer 22 in a thickness direction and which are electrically connected to the plurality of pads 23, respectively. The one principal surface of the first insulation layer 22 corresponds to the plurality of pads 23, respectively and has a plurality of projected parts 30 in which the pads 23 are arranged on top faces of the projected parts 30, and recess parts 31 arranged between the plurality of projected parts 30. The first insulation layer 22 includes: an inorganic insulation layer 11 with at least a part being arranged on the projected parts 30; and a first resin layer 10 with at least a part being arranged on the projected parts 30. The via conductor 9 pierces the inorganic insulation layer 11 and the first resin layer 10 at the projected parts 30 in the thickness direction. Accordingly, the wiring board 3 excellent in electrical characteristics can be obtained.
申请公布号 JP2015028963(A) 申请公布日期 2015.02.12
申请号 JP20130157224 申请日期 2013.07.30
申请人 KYOCERA CORP 发明人 HAYASHI KATSURA
分类号 H05K1/11 主分类号 H05K1/11
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