发明名称 PRINTED CIRCUIT BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a printed circuit board capable of reducing a transfer loss.SOLUTION: The printed circuit board comprises a first signal layer, a second signal layer, at least one reference layer and a plurality of vias. The reference layer is sandwiched between the first signal layer and the second signal layer and includes a plurality of insulation regions. Each of the first signal layer and the second signal layer includes a plurality of signal traces, and the vias are used to electrically connect the signal traces on the first signal layer and the signal traces on the second signal layer. At least two vias installed adjacently to each other correspond to the same insulation region and within the insulation region, at least two pads are provided. The at least two pads correspond to the at least two vias adjacent to each other.</p>
申请公布号 JP2015029100(A) 申请公布日期 2015.02.12
申请号 JP20140154821 申请日期 2014.07.30
申请人 KOFUKIN SEIMITSU KOGYO (SHENZHEN) YUGENKOSHI;HON HAI PRECISION INDUSTRY CO LTD 发明人 WANG TAO
分类号 H05K1/02 主分类号 H05K1/02
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