| 摘要 |
<p>Provided are a clay that has high clay film peeling strength and high heat-resistance reliability, and a printed circuit board using the same. A clay film (12) has a laminated structure wherein clay particles (20) are oriented. The space between the clay particles (20) is filled with a glass (22). The glass (22) content of the entire clay film (12) is preferably 20 mass% or less, particularly, between 5 and 15 mass% is preferable. A printed circuit board is fabricated by forming electrodes on such a clay film (12).</p> |
