发明名称 半導体装置及びその製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a resistor with a small occupied area. <P>SOLUTION: A conductive polycrystalline silicon 5 is formed on a field oxide film on a semiconductor substrate, and then contact holes reaching the polycrystalline silicon 5 are formed in an insulating film covering over the polycrystalline silicon 5. In the contact holes, a tungsten sidewall 9, a silicon oxide film sidewall 10, and a resistor 11 are formed. The resistor 11 that is vertically long is formed by disposing an electrode 12 on the resistor. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5666354(B2) 申请公布日期 2015.02.12
申请号 JP20110054903 申请日期 2011.03.13
申请人 发明人
分类号 H01L21/822;H01L21/768;H01L23/522;H01L27/04 主分类号 H01L21/822
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