发明名称 SEMICONDUCTOR MODULE, LED DRIVING DEVICE, AND LED LIGHTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor module which contributes to downsizing of a switching circuit of an LED driving device or the like.SOLUTION: A semiconductor module comprises a single supporting thin plate composed of a conductive material, a first semiconductor chip including a horizontal gate control type element, and a second semiconductor chip including a vertical rectifying element. The horizontal gate control type element includes a first main terminal, a second main terminal, and a control terminal formed on one principal surface of the first semiconductor chip. The vertical rectifying element includes an anode formed on one principal surface of the second semiconductor chip and a cathode formed on the other principal surface of the second conductor chip. The first semiconductor chip and the second semiconductor chip are fixed on the single supporting thin plate. The first main terminal is connected to the single supporting thin plate at low resistance. The cathode is directly connected to the single supporting thin plate at low resistance.
申请公布号 JP2015029040(A) 申请公布日期 2015.02.12
申请号 JP20140015873 申请日期 2014.01.30
申请人 SANKEN ELECTRIC CO LTD 发明人 IWABUCHI AKIO;YOSHIE TORU;MACHIDA OSAMU;TASAKA YASUSHI;YOSHINAGA MITSUMICHI;EBARA TOSHIHIRO;KIMURA KENGO
分类号 H01L25/04;H01L25/18;H01L33/00;H02M3/155;H05B37/02 主分类号 H01L25/04
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