| 发明名称 |
SINTERED BODY OF SILVER FINE PARTICLE |
| 摘要 |
A sintered body of silver fine particles for a bonding member to bond components of a semiconductor device, wherein an activation energy for creep of the sintered body of the silver fine particles is from 0.4 to 0.75 times that of an activation energy for a lattice diffusion of bulk silver. |
| 申请公布号 |
US2015041974(A1) |
申请公布日期 |
2015.02.12 |
| 申请号 |
US201314382617 |
申请日期 |
2013.02.26 |
| 申请人 |
NAMICS CORPORATION |
发明人 |
Kobayashi Makoto;Sasaki Koji |
| 分类号 |
B23K35/30;H01L23/00;B23K35/365;B22F3/10;B23K1/00 |
主分类号 |
B23K35/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sintered body of silver fine particles for a bonding member to bond components of a semiconductor device, wherein
an activation energy for creep of the sintered body of the silver fine particles is from 0.4 to 0.75 times that of an activation energy for a lattice diffusion of bulk silver. |
| 地址 |
Niigata-shi, Niigata JP |
