HIGH-RESISTIVITY MATERIAL-BASED PACKAGING ELEMENT FOR ELECTRIC FIELD SENSOR

摘要

A high-resistivity material-based packaging element for an electric field sensor, comprising: a substrate; a first packaging frame fixedly provided on the substrate; a first packaging cover fixedly provided on the packaging frame; at least one electric field sensor chip provided in the cavity formed by the substrate, the first packaging frame, and the first packaging cover; at least one of the substrate, the first packaging frame, and the first packaging cover is of a high-resistivity material having a resistivity equal or greater than 108&OHgr;•cm. The present invention ensures accurate electric field measurement, provides an approach to solve the problem of environmental adaptability, and enhances the stability and reliability of electric field probing.