| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting an LED in which the protective layer of a conductor circuit is formed without increasing the man-hour of cutting the plating lead wires while ensuring breakdown voltage, and wire bondability can be ensured by minimizing contamination of the surface of the protective layer, and to provide a manufacturing method therefor. <P>SOLUTION: The substrate for mounting an LED is manufactured by bonding a wiring board including a conductor circuit having a protective layer thereon and a substrate for supporting the conductor circuit, and having an opening which becomes the LED mounting part, and a metal plate arranged below the wiring board with an adhesive, having an opening corresponding to the LED mounting part interposed therebetween. The substrate for mounting an LED has a cutting hole which penetrates the wiring board and cuts the conductor circuit. On the metal plate located at the bottom of the cutting hole, the adhesive is arranged. <P>COPYRIGHT: (C)2012,JPO&INPIT |
