| 摘要 |
<p>The present invention relates to a circuit connecting material which is interposed between a first circuit member, wherein a first circuit electrode is formed on a main surface of a first substrate, and a second circuit member, wherein a second circuit electrode is formed on a main surface of a second substrate, in order to electrically connect the first circuit electrode and the second circuit electrode by the application of heat and pressure, while having the first circuit electrode and the second circuit electrode face each other. In this connection, a pressure of 1.5 MPa or less is applied. The circuit connecting material contains a film property-imparting polymer, a radically polymerizable substance, a radical polymerization initiator and conductive particles. The radically polymerizable substance contains a bi- or less-functional radically polymerizable substance, and the blending amount of the bi- or less-functional radically polymerizable substance is 50-70% by mass based on the total mass of the film property-imparting polymer and the radically polymerizable substance.</p> |
