| 摘要 |
The present invention relates to a fingerprint sensor module for mobile device and to a method for manufacturing the same, and more specifically, to a fingerprint sensor module and to a method for manufacturing the same for improving reliability and sensitivity and for removing defect in an appearance. The present invention includes: a fingerprint sensor packaging unit; and a sapphire glass which is bonded to the upper side of the fingerprint sensor packaging unit. The present invention has an effect of increasing the efficiency of fingerprint sensitivity by applying a material having excellent dielectric ratio. |
