发明名称 Deposition substrate of deposition apparatus, method of forming layer using the same, and method of manufacturing organic light emitting diode display device
摘要 Provided are a deposition substrate of a deposition apparatus, a method of forming a layer using the same, and a method of manufacturing an organic light emitting diode (OLED) display device. The method of forming a layer using the deposition substrate includes preparing a substrate, forming a heating conductive layer for Joule heating on the substrate, forming a first insulating layer on the heating conductive layer for Joule heating and including a groove or hole, forming a deposition material layer on a top surface of the first insulating layer having the groove or hole, and applying an electric field to the heating conductive layer for Joule heating to perform Joule-heating on the deposition material layer. Thus, the method is suitable for manufacturing a large-sized device.
申请公布号 US8951891(B2) 申请公布日期 2015.02.10
申请号 US201013988875 申请日期 2010.07.07
申请人 Ensil Tech Corporation 发明人 Ro Jae-Sang;Hong Won-Eui
分类号 H01L23/34;H01L51/56;H01L51/00;C23C14/04;C23C14/26;B32B3/26;B32B3/30;H01L51/50 主分类号 H01L23/34
代理机构 Cantor Colburn LLP 代理人 Cantor Colburn LLP
主权项 1. A deposition substrate of a deposition apparatus, comprising: a substrate; a heating conductive layer formed on the substrate, the heating conductive layer generating Joule-heat when applying an electric field thereto; a first insulating layer formed on the heating conductive layer and including a groove or a hole, wherein the heating conductive layer is disposed under the first insulating layer and contacts directly with the first insulating layer; and a deposition material layer formed on the first insulating layer.
地址 KR