发明名称 |
Deposition substrate of deposition apparatus, method of forming layer using the same, and method of manufacturing organic light emitting diode display device |
摘要 |
Provided are a deposition substrate of a deposition apparatus, a method of forming a layer using the same, and a method of manufacturing an organic light emitting diode (OLED) display device. The method of forming a layer using the deposition substrate includes preparing a substrate, forming a heating conductive layer for Joule heating on the substrate, forming a first insulating layer on the heating conductive layer for Joule heating and including a groove or hole, forming a deposition material layer on a top surface of the first insulating layer having the groove or hole, and applying an electric field to the heating conductive layer for Joule heating to perform Joule-heating on the deposition material layer. Thus, the method is suitable for manufacturing a large-sized device. |
申请公布号 |
US8951891(B2) |
申请公布日期 |
2015.02.10 |
申请号 |
US201013988875 |
申请日期 |
2010.07.07 |
申请人 |
Ensil Tech Corporation |
发明人 |
Ro Jae-Sang;Hong Won-Eui |
分类号 |
H01L23/34;H01L51/56;H01L51/00;C23C14/04;C23C14/26;B32B3/26;B32B3/30;H01L51/50 |
主分类号 |
H01L23/34 |
代理机构 |
Cantor Colburn LLP |
代理人 |
Cantor Colburn LLP |
主权项 |
1. A deposition substrate of a deposition apparatus, comprising:
a substrate; a heating conductive layer formed on the substrate, the heating conductive layer generating Joule-heat when applying an electric field thereto; a first insulating layer formed on the heating conductive layer and including a groove or a hole, wherein the heating conductive layer is disposed under the first insulating layer and contacts directly with the first insulating layer; and a deposition material layer formed on the first insulating layer. |
地址 |
KR |