| 摘要 |
<p>PURPOSE: A wafer backside polishing apparatus is provided to transmit or receive an optical signal to a wafer from a tester optical signal part, thereby performing a quality test of a chip within the wafer. CONSTITUTION: A wafer backside polishing apparatus comprises a wafer test part(630) and a wafer polishing part(650). The wafer test part comprises a wafer and a tester. The wafer comprises a substrate optical signal part(40) which is comprised in order to transmit or receive an optical signal. The tester comprises a tester optical signal part. The tester optical signal part transmits or receives the optical signal with the substrate optical signal part by testing chips included in the wafer. The wafer polishing part polishes the rear surface of the wafer.</p> |
