DEVICE AND METHOD OF ATOMIC PLY APPLICATION

摘要

FIELD: process engineering.SUBSTANCE: invention relates to application of atomic ply on substrate surface. Proposed device comprises injector head for gaseous precursor with extending parts including gaseous precursor feed system. Note here that said head can inject said precursor from said feed system to application zone for contact with substrate surface. Said zone is confined by said injector head and substrate surface. This device can displace said head and said substrate relative to each other in the plane of substrate surface. Said injector head comprises carrier gas injector to apply said gas between said head and said substrate surface and/or between said head and substrate holder surface. Carrier gas injector is isolated from precursor feed system to get gas carrier ply composed by carrier gas between extending parts of injector head and substrate and/or between extending parts of said head and substrate holder surface. This allows the formation of introduced gaseous precursor retaining structure in application zone adjoining to substrate surface. Additionally, this device allows relative displacement of precursor injector head and substrate outside the substrate surface subject to carrier gas pressure between substrate surface and injector head and/or between injector head and substrate holder.EFFECT: higher efficiency of gaseous precursor application.15 cl, 10 dwg