| 发明名称 | Semiconductor packages and methods of manufacturing the same | ||
| 摘要 | A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other. | ||
| 申请公布号 | US8952549(B2) | 申请公布日期 | 2015.02.10 |
| 申请号 | US201213614125 | 申请日期 | 2012.09.13 |
| 申请人 | Samsung Electronics Co., Ltd. | 发明人 | Kim Doojin;Kim Youngsik;Oh Kitaik;Hong Sungbok |
| 分类号 | H01L23/48 | 主分类号 | H01L23/48 |
| 代理机构 | Onello & Mello, LLP | 代理人 | Onello & Mello, LLP |
| 主权项 | 1. A semiconductor package comprising: a board including a board pad; a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads, respectively; bumps disposed on the chip pads, respectively; and a wire disposed between the chip pads and the bumps, the wire electrically connecting the chip pads of the plurality of semiconductor chips and the board pad of the board to each other. | ||
| 地址 | KR | ||