发明名称 Method of manufacturing semiconductor device
摘要 An object is to provide a method for manufacturing a highly reliable semiconductor device including a transistor with stable electric characteristics. A method for manufacturing a semiconductor device includes the steps of: forming a gate electrode over a substrate having an insulating surface; forming a gate insulating film over the gate electrode; forming an oxide semiconductor film over the gate insulating film; irradiating the oxide semiconductor film with an electromagnetic wave such as a microwave or a high frequency; forming a source electrode and a drain electrode over the oxide semiconductor film irradiated with the electromagnetic wave; and forming an oxide insulating film, which is in contact with part of the oxide semiconductor film, over the gate insulating film, the oxide semiconductor film, the source electrode, and the drain electrode.
申请公布号 US8952378(B2) 申请公布日期 2015.02.10
申请号 US201213570517 申请日期 2012.08.09
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Miyanaga Akiharu
分类号 H01L29/786;H01L27/12;H01L29/66 主分类号 H01L29/786
代理机构 Robinson Intellectual Property Law Office, P.C. 代理人 Robinson Eric J.;Robinson Intellectual Property Law Office, P.C.
主权项 1. A method of manufacturing a semiconductor device, the method comprising the steps of: forming a gate electrode over a substrate; forming a gate insulating film over the gate electrode; forming a source electrode and a drain electrode over the gate insulating film; and forming an oxide semiconductor film over the gate insulating film, the source electrode and the drain electrode by chemical vapor deposition; and forming a highly purified oxide semiconductor by irradiating the oxide semiconductor film with a microwave having a frequency greater than or equal to 300 MHz and less than or equal to 3 THz under an inert gas atmosphere or reduced pressure, or in air where a dew point under atmospheric pressure is −60° C. or lower to give energy to a polar molecule included in the oxide semiconductor film, so that the polar molecule is evaporated, wherein the highly purified oxide semiconductor is overlapped with the gate electrode, wherein the highly purified oxide semiconductor is partly overlapped with the source electrode and the drain electrode, and wherein the highly purified oxide semiconductor is an intrinsic semiconductor or a substantially intrinsic semiconductor.
地址 Atsugi-shi, Kanagawa-ken JP