Polycrystalline diamond compacts with partitioned substrate, polycrystalline diamond table, or both

摘要

Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.

主权项

1. A method of at least partially relieving residual stresses within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”), the method comprising:
providing a PDC including a PCD table bonded to a substrate, wherein the PCD table includes a plurality of bonded diamond grains and the substrate is formed from a single cemented carbide material; and partitioning at least the substrate of the PDC by forming a cut through an entire thickness of the substrate.