| 发明名称 |
Implementing graphene interconnect for high conductivity applications |
| 摘要 |
A method, and structures for implementing enhanced interconnects for high conductivity applications. An interconnect structure includes an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane. A winded graphene ribbon is carried around the electrically conductive interconnect member, providing increased electrical current carrying capability and increased thermal conductivity. |
| 申请公布号 |
US8952258(B2) |
申请公布日期 |
2015.02.10 |
| 申请号 |
US201213624158 |
申请日期 |
2012.09.21 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Plucinski Mark D.;Sinha Arvind K.;Thompson Thomas S. |
| 分类号 |
H05K1/09 |
主分类号 |
H05K1/09 |
| 代理机构 |
|
代理人 |
Pennington Joan |
| 主权项 |
1. A structure for implementing enhanced interconnects for high conductivity applications comprising:
an interconnect structure comprising an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane; and a winded graphene ribbon being carried around said electrically conductive interconnect member, said winded graphene ribbon providing increased electrical current carrying capability and increased thermal conductivity. |
| 地址 |
Armonk NY US |
