Circuit substrate for mounting chip, method for manufacturing same and chip package having same

摘要

A circuit board includes an insulation layer, an electrically conductive layer, and a solder mask layer. The insulation layer has a plurality of through holes passing through. The electrically conductive layer is formed on a surface of the insulation layer and covers the through holes. The electrically conductive layer has a plurality of portions exposed in the through holes to serve as a plurality of first conductive pads. The solder mask layer covers the electrically conductive layer and defines a plurality of openings to expose parts of the electrically conductive layer. Parts of the electrically conductive layer are exposed to the solder mask layer to serve as a plurality of second conductive pads. The second conductive pads are electrically connected to the first conductive pads respectively. This disclosure further relates to a chip package and a method of manufacturing the same.

主权项

1. A method for manufacturing a chip package, comprising:
providing a circuit board, wherein the circuit board comprises an insulation layer, the insulation layer has a first surface, an opposite second surface, and a plurality of through holes passing through the first and second surfaces, a patterned electrically conductive layer is formed on the first surface of the insulation layer, the patterned electrically conductive layer has a plurality of portions exposed in the through holes to serve as a plurality of first conductive pads, a solder mask layer covers the patterned electrically conductive layer, the solder mask defines a plurality of openings to expose parts of the patterned electrically conductive layer, the exposed parts of the patterned electrically conductive layer serves as a plurality of second conductive pads, the second conductive pads are electrically connected to the first conductive pads respectively, a seed layer is formed over the second surface, inner surfaces of the through holes, and the first conductive pads are exposed in the through holes, and a stiffener is attached on the seed layer on the second surface and covers the through holes at the second surface; mounting a chip to the circuit board, and electrically connecting the chip with the second conductive pads of the circuit board; and removing the stiffener and the seed layer, thereby obtaining a chip package.