发明名称 Modular connector
摘要 A modular connector includes a housing, a first circuit board, a first pin set, a second pin set and a second circuit board. The housing includes a first hole and a second hole. The first pin set is extended into the first hole and electrically connected to the first circuit board. The second pin set is extended into the second hole and electrically connected to the second circuit board. The second circuit board is perpendicularly connected to the first circuit board.
申请公布号 US8951068(B2) 申请公布日期 2015.02.10
申请号 US201313856207 申请日期 2013.04.03
申请人 Delta Electronics, Inc. 发明人 Tai Chin-Chung
分类号 H01R13/66;H01R25/00;H01R12/52;H01R13/645;H01R13/658;H01R24/64 主分类号 H01R13/66
代理机构 Muncy, Geissler, Olds & Lowe, P.C. 代理人 Muncy, Geissler, Olds & Lowe, P.C.
主权项 1. A modular connector, comprising: a housing having a first hole and a second hole; a first circuit board; a first pin set electrically connected to the first circuit board and extended into the first hole; a second pin set electrically connected to the first circuit board and extended into the second hole; and a second circuit board connected to the first circuit board perpendicularly; wherein the first circuit board includes a first circuit layer, a second circuit layer and a first blocking layer, the first circuit layer is electrically connected to the first pin set, the second circuit layer is electrically connected to the second pin set, and the first blocking layer is disposed between the first and second circuit layers; wherein the second circuit board includes a third circuit layer, a fourth circuit layer and a second blocking layer, the third circuit layer is electrically connected to the first and second circuit layers, the fourth circuit layer is electrically connected to the first and second circuit layers, and the second blocking layer is disposed between the third and fourth circuit layers; wherein a connection element electrically connected to the first and second blocking layers; wherein the first, second, third and fourth circuit layers include a plurality of electronic devices, which are of the surface mount technology (SMT) type; wherein a base disposed parallel with the first circuit board, on a side of the second circuit board and perpendicular to the second circuit board, and electrically connected to the second circuit board; wherein the base has a plurality of first identification structures, and the housing has a plurality of second identification structures corresponding the first identification structures.
地址 Taoyuan Hsien TW