发明名称 Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
摘要 Solid-state radiation transducer (SSRT) devices and methods of manufacturing and using SSRT devices are disclosed herein. One embodiment of the SSRT device includes a radiation transducer (e.g., a light-emitting diode) and a transmissive support assembly including a transmissive support member, such as a transmissive support member including a converter material. A lead can be positioned at a back side of the transmissive support member. The radiation transducer can be flip-chip mounted to the transmissive support assembly. For example, a solder connection can be present between a contact of the radiation transducer and the lead of the transmissive support assembly.
申请公布号 US8952402(B2) 申请公布日期 2015.02.10
申请号 US201113219530 申请日期 2011.08.26
申请人 Micron Technology, Inc. 发明人 Vadhavkar Sameer S.
分类号 H01L33/62;H01L21/52;H01L33/48;H01L33/50 主分类号 H01L33/62
代理机构 Perkins Coie LLP 代理人 Perkins Coie LLP
主权项 1. A solid-state radiation transducer (SSRT) device, comprising: a radiation transducer including a first semiconductor material,a contact electrically connected to the first semiconductor material,a second semiconductor material spaced apart from the first semiconductor material, andan active region between the first semiconductor material and the second semiconductor material; and a transmissive support assembly attached to the radiation transducer, the transmissive support assembly including a transmissive support member having a back side facing toward the radiation transducer, the transmissive support member including a cured matrix material and particles of converter material disposed within the cured matrix material, anda lead at the back side of the transmissive support member, the lead being electrically connected to the contact, wherein the radiation transducer is flip-chip mounted to the transmissive support assembly.
地址 Boise ID US
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