发明名称 CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To suppress the occurrence of solder explosion.SOLUTION: A ceramic electronic component includes: a rectangular parallelepiped laminated body in which a ceramic layer and an inner electrode are alternatively laminated; and an outer electrode provided on a part of a surface of the laminated body and electrically connected to the inner electrode. The outer electrode includes: an inside outer electrode covering a part of the surface of the laminated body and made of a mixture of a resin component and a metal component; and an outside outer electrode covering the inside outer electrode and made of a metal component. The inside outer electrode includes as the metal component: a first metal component a part of which forms an alloy with the inner electrode to connect the inner electrode and the inside outer electrode; and a second metal component which has a melting point higher than that of the first metal component and a part of which forms an alloy with the first metal component to connect the inside outer electrode and the outside outer electrode. A surface-metal concentration of the inside outer electrode is 17% or larger.
申请公布号 JP2015026817(A) 申请公布日期 2015.02.05
申请号 JP20140089244 申请日期 2014.04.23
申请人 MURATA MFG CO LTD 发明人 HAMANAKA KENICHI;ZENSAI KOTA;DEKURA TAKU;MAEKAWA KIYOTAKA
分类号 H01G4/30;H01G4/12;H01G4/232;H01L41/047;H01L41/293 主分类号 H01G4/30
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