发明名称 |
CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of solder explosion.SOLUTION: A ceramic electronic component includes: a rectangular parallelepiped laminated body in which a ceramic layer and an inner electrode are alternatively laminated; and an outer electrode provided on a part of a surface of the laminated body and electrically connected to the inner electrode. The outer electrode includes: an inside outer electrode covering a part of the surface of the laminated body and made of a mixture of a resin component and a metal component; and an outside outer electrode covering the inside outer electrode and made of a metal component. The inside outer electrode includes as the metal component: a first metal component a part of which forms an alloy with the inner electrode to connect the inner electrode and the inside outer electrode; and a second metal component which has a melting point higher than that of the first metal component and a part of which forms an alloy with the first metal component to connect the inside outer electrode and the outside outer electrode. A surface-metal concentration of the inside outer electrode is 17% or larger. |
申请公布号 |
JP2015026817(A) |
申请公布日期 |
2015.02.05 |
申请号 |
JP20140089244 |
申请日期 |
2014.04.23 |
申请人 |
MURATA MFG CO LTD |
发明人 |
HAMANAKA KENICHI;ZENSAI KOTA;DEKURA TAKU;MAEKAWA KIYOTAKA |
分类号 |
H01G4/30;H01G4/12;H01G4/232;H01L41/047;H01L41/293 |
主分类号 |
H01G4/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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