| 发明名称 |
WAFER SUPPORT SYSTEM FOR 3D PACKAGING |
| 摘要 |
A method for handling and supporting a device wafer during a wafer thinning process and the resulting device are provided. Embodiments include forming a plurality of solder bumps on a first surface of a substrate having a first and a second surface; removing a portion from a periphery of the first surface of the substrate; forming a temporary bonding material on a first carrier; bonding the first surface of the substrate with the temporary bonding material of the first carrier; affixing the second surface of the substrate to a second carrier; and removing the temporary bonding material. |
| 申请公布号 |
US2015035140(A1) |
申请公布日期 |
2015.02.05 |
| 申请号 |
US201313959252 |
申请日期 |
2013.08.05 |
| 申请人 |
GLOBAL FOUNDRIES Inc. |
发明人 |
AGARWAL Rahul |
| 分类号 |
H01L23/00;H01L21/768 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
forming a plurality of solder bumps on a first surface of a substrate having a first and a second surface; removing a portion from only a periphery of the first surface of the substrate; forming a temporary bonding material on a periphery of a first carrier; bonding the first surface of the substrate with the temporary bonding material of the first carrier only along the periphery of the first surface of the substrate at the location of the removed portion of the substrate; affixing the second surface of the substrate to a second carrier; and removing the temporary bonding material. |
| 地址 |
Grand Cayman KY |
