STACKED MULTI - CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A stacked multi-chip packaging structure comprises a lead frame, a first semiconductor chip mounted on the lead frame, a second semiconductor chip flipped-chip mounted on the lead frame, a metal clip mounted on top of the first and second semiconductor chips and a third semiconductor chip stacked on the meal clip; bonding wires electrically connecting electrodes on the third semiconductor chip to the first and second semiconductor chips and the pins of the lead frame; plastic molding encapsulating the lead frame, the chips and the metal clip.

主权项

1. A stacked multi-chip packaging structure comprising:
a lead frame comprising a first die paddle, a second die paddle and a plurality of pins separated from each other, wherein the second die paddle comprises a first part and a second part separated from each other; a first semiconductor chip attached on the first die paddle with a back electrode at a back surface of the first semiconductor chip electrically connected onto the first die paddle; a second semiconductor chip being flipped and attached on the second die paddle with a first front electrode and a second front electrodes at a front surface of the second semiconductor chip electrically connected onto the first part and the second part of the second die paddle respectively; a metal clip mounted on top of the first and second chips electrically attached onto a first front electrode on a front surface of the first chip and a back electrode arranged on a back surface of the flipped second chip; a third semiconductor chip having a back surface attached onto a top surface of the metal clip, the back surface of the third semiconductor chip being electrically isolated from the metal clip; bonding wires electrically connecting electrodes on a front surface of the third semiconductor chip to a second electrode on the front surface of the first semiconductor chip and the pins; and a plastic package body encapsulating the bonding wires, the first, second and third semiconductor chips, and the metal clip, parts of the pins and at least parts of the back surfaces of the first and second die paddles being exposed from the plastic package body.