PRINTED CIRCUIT BOARD STRUCTURE

摘要

A printed circuit board (PCB) structure comprises two signal layers with and a ground layer sandwiched between the two signal layers, and at least two adjacent vias. Each of the signal layers comprises a plurality of signal traces. The via through the PCB structure is used for connecting signal traces on different signal layers together. The ground layer comprises at least one insulation region. Each of the vias comprises at least two pads and a connecting portion connecting the at least two pads together. The pads are respectively mounted on the at least two signal layer. Projections of the adjacent pads on the ground layer are contained in the same insulation region.

主权项

1. A printed circuit board (PCB) structure, comprising:
at least two signal layers with a plurality of signal traces; a ground layer sandwiched between the at least two signal layers; and at least two adjacent vias through the PCB structure, and for connecting signal traces on different signal layers together; wherein the ground layer comprises at least one insulation region; each of the vias comprises at least two pads and a connecting portion connecting the at least two pads together; the pads respectively mounted on the at least two signal layer; projections of the adjacent pads on the ground layer are contained in the same insulation region.