| 发明名称 |
LIGHT EMITTING DEVICE |
| 摘要 |
A light emitting device includes a heat dissipation board, a wiring board that is bonded and fixed to the heat dissipation board and formed with a through-hole, a semiconductor light emitting element that is mounted on a face of the heat dissipation board, the face being exposed through the through-hole of the wiring board, and a light reflecting member that covers a portion of an inner peripheral wall surface of the through-hole of the wiring board, the portion being squarely opposed to a side surface of the semiconductor light emitting element. |
| 申请公布号 |
US2015036349(A1) |
申请公布日期 |
2015.02.05 |
| 申请号 |
US201414450132 |
申请日期 |
2014.08.01 |
| 申请人 |
TOYODA GOSEI CO., LTD. |
发明人 |
TSUCHIYA Yosuke;Tajima Hiroyuki;Shimonishi Shota;Takeda Shigeo;Miwa Tomohiro |
| 分类号 |
F21K99/00;F21V7/22;F21V23/00;F21V29/00 |
主分类号 |
F21K99/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device comprising:
a heat dissipation board; a wiring board that is bonded and fixed to the heat dissipation board and formed with a through-hole; a semiconductor light emitting element that is mounted on a face of the heat dissipation board, the face being exposed through the through-hole of the wiring board; and a light reflecting member that covers a portion of an inner peripheral wall surface of the through-hole of the wiring board, the portion being squarely opposed to a side surface of the semiconductor light emitting element. |
| 地址 |
Kiyosu-shi JP |
