ELECTRONIC DEVICE COMPRISING A SUBSTRATE BOARD EQUIPPED WITH A LOCAL REINFORCING OR BALANCING LAYER

摘要

A substrate board includes an electrical connection network on a face thereof. An integrated-circuit chip is mounted to the face of the substrate board in electrical contact with the electrical connection network. A local reinforcing or balancing layer made of a non-metallic material is mounted to the face of the substrate board in at least one local zone free of the face which is free of metal portions of the electrical connection network.

主权项

1. An electronic device, comprising:
a substrate board having a front face; at least one integrated-circuit chip mounted to the front face of said substrate board; wherein the substrate board further includes an electrical connection network mounted on said front face and configured to make electrical connections to said integrated-circuit chip and further having a metal region; and at least one local reinforcing or balancing layer made of a non-metallic material mounted to a face of the substrate board in at least one local zone of the substrate board which is free of metal portions of said electrical connection network.