SEMICONDUCTOR DEVICE TO BE ATTACHED TO HEAT RADIATION MEMBER

摘要

A semiconductor device includes a semiconductor module and a pressing member pressing the semiconductor module to a heat radiation member. The semiconductor module includes heat generation elements generating heat by energization, three or more conductive members each of which mounted with at least one of the heat generation elements, and a molding part integrally molding the heat generation elements and the conductive members. The semiconductor module has a heat radiation possible region in which a forcing pressure by the pressing member is equal to or greater than a predetermined pressure. The conductive member mounted with the heat generation element disposed outside the heat radiation possible region has such a shape that at least a part of the conductive member is included in the heat radiation possible region.

主权项

1. A semiconductor device comprising
a semiconductor module including a plurality of heat generation elements generating heat by energization, three or more conductive members each of which mounted with at least one of the heat generation elements, and a molding part integrally molding the heat generation elements and the conductive members, and a pressing member pressing the semiconductor module to a heat radiation member, wherein the semiconductor module has a heat radiation possible region in which a forcing pressure by the pressing member is equal to or greater than a predetermined pressure, at least one of the conductive members is mounted with the heat generation element disposed outside the heat radiation possible region, and the at least one of the conductive members has such a shape that at least a part of the conductive member is included in the heat radiation possible region.