| 发明名称 |
SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAID SHEET FOR SEALING |
| 摘要 |
A thermosetting sheet for sealing, which is used for sealing of an electronic device. One surface of this sheet for sealing has a surface roughness (Ra) of 3 μm or less before curing. |
| 申请公布号 |
WO2015015982(A1) |
申请公布日期 |
2015.02.05 |
| 申请号 |
WO2014JP67396 |
申请日期 |
2014.06.30 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
IINO, CHIE;MATSUMURA, TAKESHI;SHIGA, GOJI;MORITA, KOSUKE |
| 分类号 |
H01L23/29;H01L21/56;H01L23/00;H01L23/31 |
主分类号 |
H01L23/29 |
| 代理机构 |
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