| 发明名称 |
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING HOUSING FOR SAME |
| 摘要 |
An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device. |
| 申请公布号 |
US2015036295(A1) |
申请公布日期 |
2015.02.05 |
| 申请号 |
US201414446503 |
申请日期 |
2014.07.30 |
| 申请人 |
Fu Tai Hua Industry (Shenzhen) Co., Ltd. ;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
LIU SHYAN-JUH;HON KAR-WAI;LIU SHA-SHA |
| 分类号 |
H05K5/02 |
主分类号 |
H05K5/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising:
a housing; a mother board received in the housing, and a plurality of heat-generating members received in the housing, wherein a dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area, and each dissipation hole is in a nanometer scale. |
| 地址 |
Shenzhen CN |
